Patent · US Expired

Process for producing porous polyimide and porous polyimide

US6372808B1 · kind B1 · utility

6Cited by
5References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 30, 2001
Grant dateApr 16, 2002
Priority date
Expiry dateOct 30, 2021

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P20/54
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A porous polyimide having a finely cellular structure and having a low dielectric constant and heat resistance. The porous polyimide can be produced by a process comprising adding a dispersible compound to a polyimide precursor to form a micro-domain structure in which the dispersible compound is dispersed in the polymer so as to have a size smaller than 10 &mgr;m and then removing the dispersible compound by extraction with supercritical carbon dioxide to thereby make the precursor porous, wherein the interaction parameter &khgr;AB between the polyimide precursor A and the dispersible compound B is larger than 3. This porous polyimide has an average cell diameter smaller than 5 &mgr;m and a dielectric constant of 3 or lower.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.