Multilayer wiring board and multilayer wiring package
US6372999B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 1999 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Apr 20, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10287
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer wiring board 10 comprises a substrate having a plurality of layers of reinforced resin material 12,18,19,26,18′,19′,26′, a patterned conductive layer 28,28′ provided on at least one major surface of the substrate, a plurality of via holes 30,32,34,36 provided at least partly through the substrate, and a plurality of signal carrying wires 20,20′. The signal carrying wires 20,20′ are provided between at least two of the layers of reinforced resin material 12,18,19,26,18′,19′,26′. The signal carrying wires 20,20′ can be embedded in a resin layer 21,21′, and the resin layer 21,21′ sandwiched between a pair 18,19,18′,19 of the layers of reinforced resin material. The reinforced resin material 12,18,19,26,18′,19 is preferably a fiber reinforced resin material, such as a glass fiber reinforced epoxy or polyimide material. In some applications, a constrained core 22,24,22′,24′, e.g., a copper/ molybdenum/copper laminate, can be provided between a major surface of the substrate and the pair 18,19,18′,19 of reinforced resin layers sandwiching the signal carrying wires 20,20̸…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.