Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board
US6373000B1 · kind B1 · utility
27Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2000 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Dec 14, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1461
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.