Patent · US Expired

Micromechanical structure, sensor and method for manufacturing the same

US6373115B1 · kind B1 · utility

8Cited by

4References

19Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Stefan Kolb · Unterschleißheim, DE
Dieter Maier-Schneider · Borgo San Lazzaro, DE
Klaus-Gunter Oppermann · Holzkirchen, DE
Hans-Jörg Timme · Ottobrunn, DE

Key dates

Filing date	Aug 27, 1999
Grant date	Apr 16, 2002
Priority date	—
Expiry date	Aug 27, 2019

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81B2201/0257
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A micromechanical structure, such as a sensor, includes a substrate, a diaphragm, a cavity, a sacrificial layer and a terminating structure. The terminating structure is cut away in the region of the diaphragm in such a way that a media opening is located above the diaphragm. The diameter of the cavity is smaller over the entire circumference of the cavity than the diameter of the opening. A method for manufacturing the micromechanical structure is also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.