Electrical or electronic component encapsulated in a sealed manner
US6373130B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2000 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Mar 30, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
This electrical or electronic component with sealed encapsulation comprises:a support (1) intended to house one or more electrical or electronic components (5) from which electrically conducting tracks (6) radiate towards the periphery of the said support; anda protective and sealing casing (2) attached to the said support and hermetically sealed with respect to the latter by means of a peripheral metal bead (7), the main part of the casing, intended to be placed opposite the said support (1), being provided with hollow conducting elements (3) which pass right through the thickness of the said casing, and from the external upper end of which elements (3) electrically conducting metal tracks (9) radiate towards the periphery of the casing, the internal lower end of which elements (3) being connected to at least one electrical connection track (6) provided on the said support via a metal hybridization ball (8).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.