Ball grid array-integrated circuit testing device
US6373267B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 30, 1998 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Apr 30, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A measuring mechanism for a BGA-IC capable of facilitating and assuring the contact between a soldering ball of a BGA-IC and a BGA contact seat even if a foreign matter is sandwiched therebetween, and also capable of saving time involved in recontact therebetween, and of shortening measuring time. The measuring mechanism for a BGA-IC comprising a substrate including a BGA contact seat which is embedded therein and has a conical contact surface, wherein the BGA contact seat is connected to a tester, and the BGA-IC has the soldering ball and wherein the soldering ball contacts the conical contact surface of the BGA contact seat when the BGA-IC is tested.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.