Test handling method and equipment for conjoined integrated circuit dice
US6373268B1 · kind B1 · utility
16Cited by
39References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 1999 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | May 10, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/31907
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test handling assembly for conjoined integrated circuit dies is disclosed. The assembly has a wafer prober system having a chuck. A panel stage is coupled to the chuck and conjoined integrated circuit dies are coupled to the panel stage. A contactor is provided to communicate with the conjoined integrated circuit dies and the wafer prober system. Other features are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.