Circuit board particularly adapted for use with high density test point in-circuit testers
US6373269B1 · kind B1 · utility
0Cited by
10References
2Claims
0Family size
Inventor
Key dates
| Filing date | Oct 12, 1999 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Oct 12, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53952
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An interface circuit board (20) for high test point density electronic testing equipment has a first thickness signal portion (20c) in which all the signal traces (20e) are routed and a second, thicker integrally formed transfer portion (20d) which transfers the signal traces to a respective test pad (20g) on the lower surface of the transfer portion. The transfer portion is made thicker to strengthen the board and is made integral with the first signal portion to eliminate the need for intermediate solder joints.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.