Ceramic electronic component having lead terminal
US6373684B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2001 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Feb 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/228
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A ceramic electronic component includes electrodes each having a four layer structure including a first electrode layer made of an Ni—Ti alloy and constructed so as to adhere closely to the surface of a ceramic material defining a ceramic element, a second electrode layer made of at least one selected from the group consisting of Cu, Ag, and Au, disposed on the first electrode layer, a third electrode layer made of an Ni—Ti alloy, disposed on the second electrode layer, and a fourth electrode layer made of at least one selected from the group consisting of Cu, Ag, and Au, disposed on the third electrode layer. Lead terminals are bonded to the electrodes having the four layer structures via solder members, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.