Heat sink modular structure inside an electronic product
US6373700B1 · kind B1 · utility
44Cited by
6References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 18, 2001 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Jun 18, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention of a heat sink modular structure inside an electronic product comprises of a heat sink fan mounted on one end of an air channel pipe body blowing the heat thereon outward from an outlet of an air channel disposed inside the said air channel pipe body, and blowing another draft of cold air from an outlet of another air channel disposed inside the said air channel pipe body to the said CPU and the electronic parts adjacent to its surrounding to enable the heat generated by the other electronic parts inside the said electronic product to have sufficient air convection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.