Patent · US Expired

Electronic semiconductor module

US6373705B1 · kind B1 · utility

36Cited by

7References

8Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Gerhard Koelle · Wiernsheim, DE
Wolfgang Jacob · Horb, DE
Harald Tschentscher · Bornsteiner Straße, DE
Stephan Rees · Ludwigsburg, DE

Key dates

Filing date	Feb 13, 2001
Grant date	Apr 16, 2002
Priority date	—
Expiry date	Feb 13, 2021

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In order to improve heat dissipation and to reduce parasitic inductivity in an electronic semiconductor module, which has a carrier substrate having an electrically insulating layer, a metal layer in which printed conductors are formed via structuring and which is arranged on the upper side of the insulating layer, and a metal cooling body arranged on the lower side of the insulating layer, and at least one semiconductor component arranged on the carrier substrate, the electrically insulating layer has at least one notch, and at least one terminal face provided on the upper side of the semiconductor component facing away from the carrier substrate is electrically connected to a contact element which is directly connected to the metal cooling body via the notch.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.