Method and apparatus for optically modulating light through the back side of an integrated circuit die using a plurality of optical beams
US6374003B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1999 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Sep 30, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2201/307
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical modulator that modulates light through the semiconductor substrate through the back side of a flip chip packaged integrated circuit. In one embodiment, an optical modulator is disposed within a flip chip packaged integrated circuit die. The optical modulator includes a deflector and a diffraction grating. A first infrared optical beam having a photon energy less than the band gap energy of the semiconductor substrate is directed through the back side of the semiconductor substrate of the integrated circuit die, deflected off the deflector through the diffraction grating and back out the back side of the integrated circuit die. A second infrared optical beam having a photon energy greater than or equal to the band gap energy of the semiconductor substrate is directed through the back side of the semiconductor substrate to generate free charge carriers and increase the modulation depth of the optical modulator. The diffraction grating modulates the phase of a portion of the deflected optical beam in response to an integrated circuit signal. A resulting diffraction interference occurs between the phase modulated portions and non-phase modulated portions of the deflected opt…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.