Led component group with heat dissipating support
US6375340B1 · kind B1 · utility
81Cited by
11References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2000 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Jun 26, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An optoelectronic component group has at least two LEDs (2) which are mounted on a support (3). The support is composed of a material having a thermal conductivity of better than 1.5 W/K×m, for example ceramic or composite material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.