LGA package socket
US6375476B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2000 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Apr 21, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A socket for an LGA or BGA package is provided which is of relatively simple construction and which provides reliable and efficient interconnection of the package and a printed circuit board. The socket comprises a contact assembly having an array of resilient conductive columns having respective contact ends, the columns being mounted on a thin insulative sheet. The contact assembly is supported on a frame of insulating material and which has alignment posts for alignment of the contact assembly to the frame and for alignment of the frame and mounted contact assembly to an associated circuit board. The frame also includes elements for soldering or bonding the socket to a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.