Method for manufacturing paste for electroconductive thick film, paste for electroconductive thick film and laminated ceramic electronic part
US6375868B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2000 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Jun 30, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/092
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
There is disclosed a method for manufacturing a paste for electroconductive thick film using a solid component, a diluting solvent, a dispersant, an organic resin component, and a main solvent, wherein the boiling point of the diluting solvent is lower than that of the main solvent by about 100° C. or more, and the diluting solvent is compatible with the organic resin component and the main solvent, the method comprising a first dispersion step for obtaining a first slurry by subjecting to a dispersion treatment, a first mill base prepared through mixing the solid component, the diluting solvent and the dispersant, a second dispersion step for obtaining a second slurry by subjecting to a dispersion treatment, a second mill base prepared through mixing the first slurry with the organic resin component and the main solvent, and a step for removing the diluting solvent from the second slurry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.