Multilayer printed wiring board and its production process, resin composition for filling through-hole
US6376052B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2000 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Apr 21, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and being filled with a filler, an exposed part of the filler in the through-holes being covered with a through-hole-covering conductor layer, and a viahole formed just thereabove being connected to the through-hole-covering conductor layer.Without peeling between the through-holes and the filler, this wiring board has a satisfactory connection reliability between the through-holes and the internal layer circuit and provides a high density wiring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.