Positive resist composition
US6376151B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2000 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Oct 10, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G69/48
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A positive resist composition comprising a hydroxypolyamide represented by the following general formula (I) and a photoactive component: (wherein R1 and R3 may be the same or different and are each a tetravalent aromatic group; R2 is a bivalent aromatic group; n is an integer of 2 to 150; and Z is a monovalent organic group and at least 40% of Z is a group represented by the following structural formula (II):—X—R4—(COOH)m  (II)(wherein X is a carbonyl group or a sulfonyl group; m is an integer of 0 to 3 with a proviso that m is not 0 when X is a carbonyl group; R4 is an aliphatic group not including alkenyl group or alkynyl group, an alicyclic group or an aromatic group; and, when X is a carbonyl group and R4 is an alicyclic group or an aromatic group, at least one of the carboxylic groups is at the ortho position)).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.