Modular, energy-dissipating material and method for using it
US6376636B1 · kind B1 · utility
3Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1999 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Oct 28, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J183/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Modular, energy-dissipating material prevents failure of adhesives, fibers and composite and other structures. The modules comprise folded subunits or domains that unfold in a stepped fashion at forces below that necessary to break the backbone of the material and, with adhesive material, below that necessary to break the bonds that fasten the material to surfaces being glued.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.