Patent · US Expired

Modular, energy-dissipating material and method for using it

US6376636B1 · kind B1 · utility

3Cited by
3References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 28, 1999
Grant dateApr 23, 2002
Priority date
Expiry dateOct 28, 2019

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J183/10
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Modular, energy-dissipating material prevents failure of adhesives, fibers and composite and other structures. The modules comprise folded subunits or domains that unfold in a stepped fashion at forces below that necessary to break the backbone of the material and, with adhesive material, below that necessary to break the bonds that fasten the material to surfaces being glued.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.