Laser cutting of semiconductor materials
US6376797B1 · kind B1 · utility
96Cited by
11References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2000 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Jul 26, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of cutting thin bodies of silicon so as to minimize edge damage comprises traversing said bodies with the beam of a pulsed laser in a vacuum or in the presence of forming gas or a noble gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.