Optoelectronic structural element
US6376902B1 · kind B1 · utility
119Cited by
8References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 31, 2000 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Jan 31, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optoelectronic structural element in which an optoelectronic chip is attached to a chip carrier part of a lead frame. The lead frame has a connection part disposed at a distance from the chip carrier part, and which is electrically conductively connected with an electrical contact of the optoelectronic chip. The chip carrier part presents a number of external connections for improved conduction of heat away from the chip. The external connections project from a casing and at a distance from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.