Semiconductor package
US6376905B2 · kind B2 · utility
24Cited by
1References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2001 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Jan 24, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin encapsulated semiconductor package, which uses leads (lead frame), and enhances heat conducting properties and prevents breaking of lengths of bonding wire, reduction in service life of solder joints and crack of a resin while ensuring reliability on strength. A lead material uses a material containing as a main constituent material a composite alloy of Cu2O and Cu, which has a thermal conductivity as high as that of copper alloys having been conventionally used, and which is sintered to have a small linear expansion coefficient as compared with such copper alloys.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.