IC device inspection apparatus
US6377064B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 29, 2000 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Jun 29, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2875
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An IC device to be inspected is received in a chamber, and an IC tester Judges performance of the IC device. An electrical connection device is arranged outside the chamber and has a conductive passage electrically connecting between the IC tester and the IC device. An IC socket is retained on the electrical connection device, for having the IC device inserted therein. A magnetometric sensor is arranged close to the conductive passage of the electrical connection device, for detecting a magnetic field generated when electric current is supplied to the IC device. A temperature control device controls a temperature of the IC device. A control unit controls the temperature control device based on a signal delivered from the magnetometric sensor, to maintain the temperature of the IC device within a predetermined temperature range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.