Heat pipe hinge structure for electronic device
US6377452B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1999 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Dec 17, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portions. The hinge portion is made of a low heat-conductive material to fix the heat pipe hinge member on at least one housing portion of the pair of housing portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.