Chip cooling management
US6377459B1 · kind B1 · utility
28Cited by
13References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2000 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Aug 4, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling assembly for cooling chips is disclosed. The assembly includes a heat sink, a plate member, and a heat pipe. The heat sink is attachable to a first chip. The plate member is attachable to a second chip. The heat pipe is arranged between the heat sink and plate member such that one end of the heat pipe attaches to the heat sink and the other end of the heat pipe attaches to the plate member. A system for cooling chips and method for dissipating heat generated by chips are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.