Circuit board assembly with heat sinking
US6377462B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2001 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Jan 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit assembly includes a printed circuit board which has a plurality of copper traces formed thereon. Heat generating electronic components are surface mounted on the board in contact with parts of the traces. A heat conducting copper plate is mounted on the board adjacent to and spaced apart from the electronic components, and in contact with other parts of the traces. A silicon pad is mounted on the plate, and a heat sink member is mounted on the pad so that the pad is between the heat sink member and the traces. Heat conducting solder bridges are formed between the edges of the electronic components and the edges of the plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.