Multiple chip module with integrated RF capabilities

US6377464B1 · kind B1 · utility

Assignee

• Conexant Systems, LLC · US

Inventors

• Hassan S. Hashemi · Laguna Niguel, US
• Shiaw Wen Chang · Thousand Oaks, US
• Roger J. Forse · Wauconda, US
• Evan McCarthy · Brooks Road, US
• Trang N. Trinh · Cypress, US
• Thuy Thomas Tran · Fairfax, US

Key dates

• Filing date: Jan 29, 1999
• Grant date: Apr 23, 2002
• Expiry date: Jan 29, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.