Electrical grounding schemes for socketed processor and heatsink assembly
US6377474B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2000 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Jan 13, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/947
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A computer processor socket has a base with grounding and signal holes. Each hole contains a pin for electrical interconnection with a circuit board. The socket also contains a grounding device around its perimeter. The grounding device has a continuous ring of wiping members on its upper end. When a processor is mounted to the top of the socket, the wiping members extend slightly above the processor. The heatsink mounted on top of the processor engages the wiping members which are spring-biased against its lower surface. Since the wiping members extend completely around the perimeter of the socket, a continuous electrical ground interface is formed between the heatsink and the socket. The lower ends of the grounding device are electrically interconnected with the socket grounding pins which are grounded to the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.