Method for edge mounting flex media to a rigid PC board
US6378757B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2001 |
| Grant date | Apr 30, 2002 |
| Priority date | — |
| Expiry date | Jan 31, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Edge mounting flexible media to a rigid PC board construction can be achieved by various methods. In any method used, there is a desire to create solderable pads on the edge of the rigid PC board. In accordance with the invention, the solderable pads are created by edge plating the PC Board or by a sliced via method. Depending on the type of flexible transmission line used, the construction will differ accordingly. For terminating flexible circuit media, the flex pads are laid out in such a way that the pads are etched in a configuration that matches up with the edge pads on the rigid PC Board. Solder past is then applied to the pads on the flex. The rigid PC Board is fixtured at a right angle to the flex and run through the reflow oven.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.