Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer
US6379222B2 · kind B2 · utility
16Cited by
5References
6Claims
0Family size
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Key dates
| Filing date | Jun 14, 1999 |
| Grant date | Apr 30, 2002 |
| Priority date | — |
| Expiry date | Jun 14, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Areas of different temperatures are provided on a semiconductor wafer to improve uniformity in polishing rates during CMP.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.