Process for seaming interlocking seams of polyimide component using polyimide adhesive
US6379486B1 · kind B1 · utility
1Cited by
13References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2000 |
| Grant date | Apr 30, 2002 |
| Priority date | — |
| Expiry date | Jul 13, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1066
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A process for providing a seamed flexible polyimide component by providing a poly(amic acid) at the seam between interlocking mutually mating seam elements, and curing the seam, thereby converting the poly(amic acid) into a polyimide adhesive at the seam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.