Thermoplastic molding compounds

US6380306B1 · kind B1 · utility

Assignee

• BASF SE

Inventors

• Peter Ittemann · Lampertheim, DE
• Rainer Neumann · Krefeld, DE
• Joachim Seibring · Freinsheim, DE
• Bernhard Rosenau · Neustadt, DE
• Manfred Kötting · Mutterstadt, DE
• Christophe Ginss · Wolxheim, FR
• Norbert Güntherberg · Speyer, DE
• Christian Meyer · Demarest, US

Key dates

• Filing date: Mar 25, 1999
• Grant date: Apr 30, 2002
• Expiry date: Mar 25, 2019

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L51/04
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Thermoplastic molding materials ofA) from 72 to 88.5% by weight of a thermoplastic styrene or &agr;-methylstyrene polymer or copolymer,B) from 10 to 20% by weight of a first graft polymer having an average particle diameter d50 from 400 to 600 nm, having an n-butyl acrylate based rubber-elastic graft core, and a styrene or &agr;-methylstyrene (co)polymer graft shell,C) from 1.5 to 8% by weight of a second graft polymer having a bimodal particle size distribution, the average particle diameter d50 being from 25 to 200 nm and from 350 to 550 nm, having a butadiene or isoprene polymer or copolymer based rubber-elastic graft core, and a styrene or &agr;-methylstyrene (co)polymer graft shell,D) from 0 to 50% by weight of conventional additives,where the graft polymers B) and C) constitute from 11.5 to 25% by weight of components A), B) and C), and components A) to D) amount to 100% by weight.