Laser welded inkjet printhead assembly utilizing a combination laser and fiber optic push connect system
US6380511B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 24, 1998 |
| Grant date | Apr 30, 2002 |
| Priority date | — |
| Expiry date | Nov 24, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/328
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The disclosure describes a method for the solderless laser welding of two materials by using a laser light beam attached to a fiber optic system which directs the light to a region where the laser beam can shine through one of the materials to create a seam weld. By using a fiber optic system the laser beam is optimally converted into thermal energy and weld flaws due to underheating or destruction of the materials due to overheating does not occur. The method and apparatus provide rapid, reproducible laser welding even for the smallest of contact geometries. For example, the method results in solderless gold-to-gold compression laser welding of a silicon substrate to the material contained in a polymer flex circuit tape, such as a polyimide, without damaging the tape. A strong solderless gold-to-gold bond can be formed between a gold bond line, or complex weld seam pattern, on the flex circuit tape and a mating gold bond line or weld seam pattern on a semiconductor chip. Such a bond is formed without any damage to the tape and prevents delamination and nozzle skewing during the adhesive curing process of other methods. The reduced nozzle skewing provides less dot placement error f…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.