Non-contact type IC card and process for manufacturing same
US6380614B1 · kind B1 · utility
20Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2000 |
| Grant date | Apr 30, 2002 |
| Priority date | — |
| Expiry date | Jun 23, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/81395
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An IC card comprises: a plane coil having respective terminal sections; a semiconductor element arranged at a position not overlapping with the plane coil, the semiconductor element having electrode terminals; means for electrically connecting the respective terminal sections of the plane coil to the electrode terminals of the semiconductor element; and a reinforcing frame arranged on a face substantially the same as that of the semiconductor element so that the semiconductor element is surrounded by the reinforcing frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.