Electrode terminal connection structure of semiconductor module
US6380617B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 3, 1999 |
| Grant date | Apr 30, 2002 |
| Priority date | — |
| Expiry date | Sep 3, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The side of one of the source electrodes 7a and 7b of two semiconductor modules Q1 and Q2 corresponding to a pair of upper and lower arms are installed parallel with the outer side of the other source electrode inside packages 8a and 8b. Both the modules are arranged parallel to one another in such a way that both the sides are opposed, an inter-module electrode terminal 15 for connecting the source electrode 7a of the module Q1 and the drain electrode (base substrate) 6b of the module Q2 is formed in a block shape, and one end of the inter-module electrode terminal 15 is vertically installed parallel and close to the side of the source electrode 7b on the base substrate of the module Q2. A positive electrode terminal 12 made of a block of a conductive metal is vertically installed so as to be electrically connected with both the base substrate 6a of the module Q1 and the lower positive electrode 10 of a bus electrode panel 5 parallel and close to the side of the source electrode 7a and to mechanically support the bus electrode panel 5.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.