Semiconductor device and manufacturing method thereof
US6380621B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2000 |
| Grant date | Apr 30, 2002 |
| Priority date | — |
| Expiry date | Apr 5, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrically reliable heat radiating package provided with ball grid array (BGA) structure and a method of manufacturing the package are disclosed.In the concrete, a semiconductor chip is mounted on one surface of a ceramic wiring board via a first soldered bump electrode and resin is filled in a gap area between the one surface of the wiring board and the principal surface of the semiconductor chip. A heat diffusing plate formed in larger plane size than that of the semiconductor chip by aluminum nitride is arranged on the rear surface opposite to the principal surface of the semiconductor chip and soldered.Further, a radiating fin made of aluminum is provided on the heat diffusing plate and stuck via silicone rubber in which thermally conductive filler is included.Further, the above first soldered bump electrode and a second soldered bump electrode with a lower melting point than that of solder used for the above soldering are formed on the rear surface of the above ceramic wiring board and the above BGA package provided with heat radiating structure is formed.This BGA package is mounted on a glass epoxy wiring board at low temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.