Surface mount conductive polymer device
US6380839B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2001 |
| Grant date | Apr 30, 2002 |
| Priority date | — |
| Expiry date | Feb 2, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49085
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A surface mount conductive polymer device includes a layer of conductive polymer material laminated between first and second metal foil electrodes. A thermal stress relief area is formed as an etched-out area in each of the electrodes. The etched-out areas are equal in surface area, and they are symmetrically disposed on the two electrodes, so that the two electrodes are themselves symmetrical, and are subject to equal degrees of thermal stress relief. First and second opposed end terminals are formed on the opposed ends of the laminated structure to providing electrical connection to the first and second electrodes, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.