Integrated semiconductor optical amplifier system
US6381066B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2000 |
| Grant date | Apr 30, 2002 |
| Priority date | — |
| Expiry date | Oct 4, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/5018
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor optical amplifier system comprises a hermetic package. In the typical implementation, this hermetic package is a standard 0.75 inch×0.5 inch package, such as a butterfly package. An optical bench is sealed within this package. A first fiber pigtail enters this package via a feed-through to connect to the bench and terminate above the bench. A second optical fiber pigtail enters the package via a second fiber feed-through to connect to the bench and similarly, terminate above the bench. A semiconductor amplifier chip is connected to the bench to provide amplification. Isolators are further incorporated along with a monitoring diode to yield a fully integrated system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.