Integrated lead suspension flexure with balanced parallel leads for insulator layer hygrothermal compensation
US6381100B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1997 |
| Grant date | Apr 30, 2002 |
| Priority date | — |
| Expiry date | Dec 18, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/484
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexure for an integrated lead head suspension comprising a metal spring layer having a metal base region, a metal head bonding platform, and one or more metal spring arms connecting the metal head bonding platform to the metal base region for flexure motion. The flexure also includes a conductive lead layer having lead base region portions extending over the metal base region and lead suspended portions spaced from and adjacent to at least one of the metal spring arms. The flexure further includes an insulator layer between the metal spring layer and the conductive lead layer that has insulator base region portions for bonding the lead base region portions to and insulating the lead base region portions from the metal base region. The insulator layer also has insulator suspended portions on a lower surface of the lead suspended portions and insulator spring arm portions on an upper surface of the metal spring arms adjacent to the lead suspended portions. A first curvature is induced on each insulator suspended portion and a second curvature is induced on each insulator spring arm portion when the insulator layer undergoes volumetric variations. The direction of the second curvat…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.