Clip and pin field for IC packaging
US6381836B1 · kind B1 · utility
17Cited by
20References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1998 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Feb 23, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic assembly that incorporates a heat sink. The subassembly includes an integrated circuit package that is mounted to a substrate. The substrate is mounted to a spacer block which includes a pin field that contains a plurality of pins. The heat sink is coupled to the integrated circuit package by a clip that wraps around the sink and is attached to the spacer block.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.