Device for forming heat dissipating fin set
US6382307B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2001 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Apr 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A device for forming a heat dissipating fin set comprises a heat tube made of copper, and at least one heat dissipating fin set made of metal. Each fin in the heat dissipating fin set having a though hole. One side of the though hole is extended with a combining portion. A slender hole with a smaller diameter is formed on an upper edge of the though hole; the heat dissipating fin set being engaged to the heat tube through the though holes. A metal wire selected from silver, tin or copper is arranged into the slender holes at an upper edge of fin in the heat dissipating fin set; and then the heat tube and heat dissipating fin set are combined by heat melting. Thereby, a device for forming a heat dissipating fin set with a heat resistor without any interface and having a preferred heat conductance is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.