Method and structure for measuring temperature of heater elements of ink-jet printhead
US6382773B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2000 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Nov 3, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/14153
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method and a structure for measuring the temperature of heating elements of an ink-jet printhead are provided, wherein an extra metal layer or semiconductor layer is formed on the ink-jet chip having driving elements to precisely measure the temperature of each individual heating element. The structure includes: an ink-jet device including a heating element for heating liquid ink; a transistor driver for driving a transistor to control heating of the heating element; and a temperature-sensing layer located between the ink-jet device and the transistor driver and under the heating element, the temperature-sensing layer having two terminals, one connecting to the transistor and the other connecting to an electrode terminal connected to a printer, wherein the ink-jet device connects to the transistor driver through the temperature-sensing layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.