Multilayered polishing pad, method for fabricating, and use thereof
US6383066B1 · kind B1 · utility
41Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2000 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Jun 23, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A multilayered polishing pad especially suitable for chemical-mechanical polishing or planarizing metal, semiconductor or optical surfaces is provided. The invention allows the mechanical and polishing properties of the several layers to be independently varied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.