Aqueous dispersion for chemical mechanical polishing
US6383240B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2000 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Jan 29, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
It is an object of the present invention to provide an aqueous dispersion for CMP that has low generation of coarse particles from abrasive particles or the like during storage or transport and maintains excellent polishing performance The aqueous dispersion for CMP according to the first aspect of the invention comprises abrasive particles, an amphipathic compound and water. The aqueous dispersion for CMP according to the second aspect of the invention comprising abrasive particles and water, wherein a boundary film is formed at the interface between the aqueous dispersion and the air. The boundary film may comprise an amphipathic compound. The HLB value of the amphipathic compound is preferably greater than 0 but no greater than 6. As amphipathic compounds there may be used one or more compounds selected from among [1] aliphatic alcohols, [2] fatty acids, [3] sorbitan fatty acid esters, [4] glycerin fatty acid esters, [5] propylene glycol fatty acid esters and [6] polyethylene glycol fatty acid esters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.