Treatment solution and treatment method for reducing copper oxides
US6383254B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2001 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Jul 2, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22B15/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There are provided a treatment solution for reducing a copper oxide formed on the surface of copper to copper, wherein dimethylamine borane is contained in an amount of 0.3 to 2.0 g/L and the relationship y≧0.232x−0.185 holds between the concentration y (g/L) of dimethylamine borane and an area x (dm2/L) to be treated per unit solution amount, and a treatment method for reducing a copper oxide formed on the surface of a copper material to copper by dipping the copper material in the treatment solution as described above, wherein the addition of dimethylamine borane to water is carried out within 10 minutes before the dipping of the copper material or after the dipping of the copper material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.