Spiral anode for metal plating baths
US6383352B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2000 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Feb 14, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/001
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A metal anode having at least a portion of which formed in a spiral configuration is disclosed. The spacing between the adjacent spirals of the anode is essentially uniform in order to provide uniform fluid flow and electrical characteristics. The anode may be formed of a metal rod or sheet or may be cast from a metal. The anode surfaces of the spiral may be flat or have a configuration such as a corrugated surface to enhance the surface area of the anode. The use of spacers, electrically conductive or insulative, within the spaces between the spirals to maintain their uniform distance is also disclosed. The use of one or more buss bars enables the anode to be supplied with a constant electrical source and may also function as a means for monitoring anode consumption over time. The anode is preferably used in an electroplating bath as the source of the metal used for plating. This is particularly of value in the electroplating of silicon wafer surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.