Patent · US Expired

Hot melt pressure sensitive adhesive composition

US6384138B1 · kind B1 · utility

20Cited by
6References
25Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 2, 1999
Grant dateMay 7, 2002
Priority date
Expiry dateSep 2, 2019

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J2423/006
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

A hot melt pressure sensitive adhesive for use with oriented polypropylene films is provided. The adhesive composition comprises an elastomeric component which is a blend of styrene-isoprene block copolymers and styrene-butadiene block copolymers mixed with a tackifier component. The tackifier component is a blend of at least two hydrocarbon resins, the first being compatible with the styrene-isoprene block copolymer and the second being compatible with the styrene-butadiene block copolymer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.