Micro-electromechanical system device
US6384353B1 · kind B1 · utility
190Cited by
15References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2000 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Feb 1, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A Micro-Electromechanical Systems (MEMS) device (100) having conductively filled vias (141). A MEMS component (124) is formed on a substrate (110). The substrate has conductively filled vias (140) extending therethrough. The MEMS component (124) is electrically coupled to the conductively filled vias (140). The MEMS component (124) is covered by a protective cap (150). An electrical interconnect (130) is formed on a bottom surface of the substrate (110) for transmission of electrical signals to the MEMS component (124), rather than using wirebonds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.