Pbga package with integrated ball grid
US6384471B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2001 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Jan 4, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1532
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention concerns a package for an integrated circuit (3) of the type comprising a cavity (2) in which the integrated circuit (3) is mounted, the active surface (10) of the integrated circuit (3) being electrically connected to the package on the level of connection (Nc) of an array of balls (13i) to the package, providing a mechanical and electrical link between the integrated circuit (3) and a printed circuit card to which the package must be assembled. It is characterized in that it comprises an additional layer (14) that is rigid and electrically neutral, mounted on the level of connection (Nc) of the integrated circuit (3) and the balls (13i) and containing the balls (13i).It particularly applies to the connections of BGA and PBGA packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.