Semiconductor integrated circuit and printed wiring substrate provided with the same
US6384476B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 13, 2000 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Apr 13, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
When a semiconductor integrated circuit having a plurality of electrode pads disposed in an array-like form on the bottom surface thereof is mounted on a printed wiring substrate, a plurality of ground electrode pads and a plurality of power supply electrode pads are concentratedly arranged on the central portion of the semiconductor integrated circuit mounted on the printed wiring substrate so as to constitute groups so as to be opposed to each other, and a decoupling capacitor is mounted on the opposite surface of the printed wiring substrate through a through-hole, whereby the creation of radiation noise is suppressed and the higher density of the printed wiring substrate is achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.