Microwave and millimeter wave device mounted on a semiconductive substrate and comprised of different kinds of functional blocks
US6384701B1 · kind B1 · utility
23Cited by
10References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 1999 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Feb 19, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microwave and millimeter wave device includes: a dielectric substrate including at least one signal line, a passive circuit and a first grounding conductor portion which are formed on a surface side of the dielectric substrate; and a semiconductor substrate including a plurality of active elements. The signal line is physically and electrically connected to an input/output terminal of the active element via a metal bump; and the first grounding conductor portion is physically and electrically connected to a grounding terminal of the active element via another metal bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.